Applications and processes: Applications and processes: MEMS package sealing with getter activation Rapid Thermal Annealing/Processing Solder Bump Reflow with Plasma pre-cleaning Reflow Soldering, voidfree, fluxless and leadfree Baking and curing of photoresists Sensitive BCB Curing AuGe/SiAu alloying Flip-Chip soldering Package lead sealing Laser/RF/power die attachment Rapid Thermal Processing of Solar Cells by Silicon Wafer Bonding on low cost substrates Processing of high efficiency silicon solar cells by bonding to borosilicate glass