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UniTemp - your partner for all kind of thermal processes

We develop and sell equipment for microelectronics.
Our main focus is based on thermic process engineering.
UniTemp combines the technical, ergonomical and economical function
with perfect harmony in technics and design to achieve best quality.
All UniTemp products are developed and manufactured in Germany.

Product lines:

REFLOW SOLDERING SYSTEMS
  • Reflow solder systems
  • 2 Zone High vacuum sealer for MEMS package

    RAPID THERMAL PROCESS OVENS
  • Rapid Thermal Process ovens with vacuum
  • Plasma Cleaning and heating

    OTHERS
  • Portable Vacuum Leak Detector

    WIRE BONDER
  • Wire Bonder semiautomatic WB-100
  • Wire Bond Tools
  • Manual Pull-Testing (destroying and non-destroying)
  • Hot chucks and hot plates

    DIE BONDER AND WAFER SCRIBERS
  • Pick & Place Die Bonder (Cefori)
  • Wafer scriber, breaker and sorter (Cefori)

  •   © 2007-2010 UniTemp GmbH | Last Update: 23.08.2010
    Plasma Cleaning & Heat
    High vacuum sealer for MEMS
    Rapid Thermal Process Ovens
    Reflow Solder Systems
    Hot chucks with external controller
    Hot plates with Lift Pins
    Hot Plates with integrated controller
    Die Bonder
    WIre Bonder
    Wafer scriber manual
    Wafer scriber automatic
    Wire bond tools
    Vacuum Leak detector
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