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Precision diamond scriber for manual wafer scribing
This reliable Diamond Scriber performs fast, easy and precise scribing and cutting of silicon wafers, as well as thin- and thick film ceramic and glass substrates. It forms the grooves necessary for effective glass or ceramic cutting: shallow, even and coninuous. All essential operating parameter - the angle of the scribing tool, the scribing force, the touchdown point and the lift up point of the tool are precisely adjustable to ensure optimal flexibility and repeatable results. The scriber has got a rotatting X-Y table with universal vacuum chuck for any size wafers up to 8" dia or ceramic substrates up to 8" x8 ". The X adjustment is performed by a precision ball screw with a digital readout +/- 10 µm. The table with chuck is moveable in the Y-(scribing) direction by hand. The scribing tool touches down the substrate or wafer surface on an adjustable touchdown point and is automatically lifted after leaving the scribing area. The lift-up point is adjustable too. The lowering and lifting of the tool can also be performed manually. A 50x magnification Microscope with cross hair and coaxial illumination can be aligned with the trace of the diamond so that the paths of the wafer or substrate, where the cut has to be performed, need to be aligned with the cross hair of the microscope.
Technical Data:
for wafer size up to 8" or substrate size 200 x 200 mm
X/Y adjustment by micrometer screw and X-Y table
with vacuum chuck
Dimension: 500x500x300mm
Weight: 25 kg
spare parts and accessories:
RV-129-D Spare diamond scriber tool
VAPU-100 Vacuum pump
Ask for a video to see how it works.
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