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Die Bonder PP5
for the following applications:
Pick & Place
Flip chip assembly
very small and large components, IC, capa-chips,
resistor chip...
Standard Applications:
MEMS, MMIC, Opto or IR Sensor, Laser diodes, strength gage
Model: PP5 with table on the top
Accuracy: Up to 5 µm, Up to 1 µm (option flip)
Die size: minimum 200*200 µm, maximum 50*50 mm
Substrate size: Up to 150x500 mm
Part fixture: by vacuum or clamp
Motorized Tables: X 240 mm , Y: 90 mm , Manual theta.
Speed: by joystick.
Table resolution 1 µm
Alignment: Manual with color CCD
Digital Target generator
Optical Zoom X12
Direct placement
2 references points for auto-centering placement
ndexed Pick and Placement mode
Parameters: On LCD screen
Bond force: Programmable 10g up to 3 000 g
Bond Time: Programmable 0 up to 999 s
Scrub: X Y and number
Vacuum: Selectable on or off during bond
Temperature: Programmable 0° up to 400°(option eutectic)
Work height: adjustable
Soft touch down speed
Automatic pick up with pick up force
Options:
Ultasonic die bonding, Au SnPb
Dispenser for glue or solder paste
Stamping capability
Dipping on Flux
Reflow, thermal cycle is programmable
Eutectic, thermal cycle is programmable
Gas environement for high temp. cycle
Hot Gaz Jet, for local eutectic (multiple die eutectic)
Wafer sorter 4", 6", 8"
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