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Plasma Cleaning & Heat
High vacuum sealer for MEMS
Rapid Thermal Process Ovens
Reflow Solder Systems
Hot chucks with external controller
Hot plates with Lift Pins
Hot Plates with integrated controller
Die Bonder
WIre Bonder
Wafer scriber manual
Wafer scriber automatic
Wire bond tools
Vacuum Leak detector
PTP-300
Universal temperature and plasma cleaning machine with maximum part loading area: 309mmx319mm (35mm max. part height)
Applications:
Activation, cleaning and coating of surfaces
fast ramp up heating of substrates and wafers
fluxless soldering
flip chip processing
adhesive bonding
Solder bump reflow
Soldering of power devices
small series production and prototype development
Technical Data PTP-300:
Loading area:
309mmx319mmx35mm (process area)
Chamber height:
35 mm
Chamber material:
aluminium / quartz
Chamber material (optional):
Aluminium or quartz glass process chamber (size: 305x305x26mm)
Dimension outside:
600mmx1850x880 mm (WxDxH)
Chamber:
integrated gas inlet / 2 gas lines are standard
Gas lines:
2 Mass Flow Controllers
Vacuum:
DN25 KF vacuum flange
Heating:
24 infrared lamps (total 18kW)
Process control by:
SPS Controller PP420 (B&R) with LCD display
Maintenance:
Ethernet
Microwave generator:
for plasma cleaning or removal of oxyde resists
2,45 GHz, max. 600 Watts
stepless from 100 Watts to 600 Watts
Cooling:
water cooling required (water cooler optional)
Power:
3/N/PE; AC; 50/60 Hz; 230/400V
Weight:
150-200kg (depends on acessories)
Options and accessories:
PTP-AL
Automatic Loading
PTP-MFC
Mass Flow Controller
PTP-RPP
Double stage rotary vane pump for vacuum up to 10-3 mbar (torr)
PTP-HVP
Turbomolecular pump with valve and Pirani gauge for vacuum up to 10-6 mbar (torr)
PTP-WC
Closed loop water cooling system
Available downloads:
(Please right-click on the link and choose "Save target as...")
General Information about Plasma technology
plasmageneral.pdf (681 KB)
Typical Plasma applications
plasmatypical.pdf (44 KB)
PTP
ptp.PDF (228 KB)
© 2007-2010 UniTemp GmbH | Last Update: 23.08.2010
Plasma Cleaning & Heat
High vacuum sealer for MEMS
Rapid Thermal Process Ovens
Reflow Solder Systems
Hot chucks with external controller
Hot plates with Lift Pins
Hot Plates with integrated controller
Die Bonder
WIre Bonder
Wafer scriber manual
Wafer scriber automatic
Wire bond tools
Vacuum Leak detector
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