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Reflow Solder Systems

We offer different kind of table top and space saving systems (for R&D use, for prototyping and small series production)

  • Reflow Solder Oven RSO-650 (up to 650 °C)
  • Mini Reflow Solder System RSS-110, RSS-160, RSS-210 or RSS-310 (up to 450 °C)

  Model Heated/solder area  Tmax °C ramp up rate ramp down rate specials

RSS 3X210
630 x 210 mm 300 °C 120 K/min 60 K/min lift pins vacuum

RSS-160
160x160x40mm 450 °C 100 K/min 100 K/min

RSS-310
310x310x40mm 450 °C 150 K/min 90 K/min

VSS-450-300 Vacuum Reflow Solder System
320 x 320 mm 450 °C 4 K/sec 120 K/min also for contaminating processes applicable

RSS-210
210x210x40mm 450°C 240 K/min 120 K/min

RSS-110
110x110x40mm 450°C 120 K/min
100 K/min

RSO-650-200 and RSO-650-300
200x170x35 mm or 309x319x35mm 650°C 75°C/sec (RSO-650-200)

depends on model
© 2007-2012 UniTemp GmbH · Last Update: 17.04.2012 · 5 User online