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Rapid Thermal Process Ovens

We are specialized in developing of rapid thermal annealing systems, mainly for R&D use. Actually we offer 3 different systems, depending on customers process demands. For special applications, wishes or options please do not hesitate to contact us.


  Model for wafer/substrate size  Tmax °C ramp up rate ramp down rate specials

RTP-1000-150 Front loading
150 mm diam or 6 inch 1000 °C 75 K/sec T=1000 °C up to 400 °C better 200 K/min
T= 400 °C up to 100 °C max. 30 K/min

VPO-1000-300 Top loading
300 mm 1000 °C 40 K/sec T=1000 °C up to 400 °C better 200 K/min
T= 400 °C up to 100 °C max. 30 K/min
also for contaminating processes applicable

RTP-1200-100 Front loading
100 x 100 mm², 100 mmø 1200 °C 150 K/sec T = 1200 °C up to 400 °C better 200 K/min.
T = 400 °C up to 100 °C max. 30 K/min.
© 2007-2012 UniTemp GmbH · Last Update: 17.04.2012 · 5 User online