PTP-300
Universal temperature and plasma cleaning machine with maximum part loading area: 305 mm x 305 mm (25 mm max. part height) Applications: - Activation, cleaning and coating of surfaces
- fast ramp up heating of substrates and wafers
- fluxless soldering
- flip chip processing
- adhesive bonding
- Solder bump reflow
- Soldering of power devices
- small series production and prototype development
Technical Data PTP-300: | Loading area: | 305 mm x 305 mm x 25 mm (process area) | | Chamber height: | 35 mm | | Chamber material: | Aluminium / quartz glass | | Chamber material (optional): | Aluminium or quartz glass process chamber (size: 305 x 305 x 26 mm) | | Dimension outside: | 600 mm x 1850 x 880 mm (WxDxH) | | Chamber: | integrated gas inlet / 2 gas lines are default | | Gas lines: | 2 Mass Flow Controllers | | Vacuum: | DN25 KF vacuum flange | | Heating: | 24 infrared lamps (total 18 kW) | | Process control by: | SPS Controller PP420 (B&R) with LCD display | | Maintenance: | Ethernet | | Microwave generator: | for plasma cleaning or removal of oxyde resists 2,45 GHz, max. 600 W, stepless from 100 W to 600 W | | Cooling: | water cooling required (water cooler optional) | | Power: | 3/N/PE; AC; 50/60 Hz; 230/400 V | | Weight: | 150-200 kg (depends on acessories) |
Options and accessories:
| PTP-AL | Automatic Loading | | PTP-MFC | Mass Flow Controller | | PTP-RPP | Double stage rotary vane pump for vacuum up to 10-3 mbar | | PTP-HVP | Turbomolecular pump with gate valve and Pirani gauge for vacuum up to 10-6 mbar | | PTP-WC | Closed loop water cooling system |
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