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Plasma Cleaning & Heat
 
High vacuum sealer for MEMS
 
Rapid Thermal Process Ovens
 
Reflow Solder Systems
 
Hot chucks with external controller
 
Hot plates with Lift Pins
 
Hot Plates with integrated controller


HP-155

HP-220

HPP-155
 
Die Bonder
 
Wire Bonder
 
Wafer scriber manual
 
Wire bond tools
 

Hot Plates with integrated controller

  • these programmable hot chucks allow fixturing of the parts by vacuum
  • RS-232 as option
  • Windows based software as option
  • Lift pins as option
  • vacuum pump as option

HP-155
 		HP-155
Compact hot plate with integrated precision controller Reflow of any soldering alloy Pre-heating for wire bonding Expoy curing Laboratory tests.
   

HP-220
 		HP-220
Programmable hot plate with integrated high precision Eurotherm controllerand vacuum hold for 2 pc 100mm wafer/substrrate size.
   

HPP-155
 		HPP-155
Programmable Hot Plate/B]with vacuum hold for 3" up to 6" wafer size wafer size or 150x150mm substrate size.
   

© 2007-2012 UniTemp GmbH · Last Update: 17.04.2012 · 6 User online