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Plasma Cleaning & Heat
 
High vacuum sealer for MEMS
 
Rapid Thermal Process Ovens
 
Reflow Solder Systems
 
Hot chucks with external controller
 
Hot plates with Lift Pins


HPH-300 Hot chuck for 300mm wafer

HPP-155-L
 
Hot Plates with integrated controller
 
Die Bonder
 
Wire Bonder
 
Wafer scriber manual
 
Wire bond tools
 

Hot plates with Lift Pins


HPH-300 Hot chuck for 300mm wafer
 		HPH-300 Hot chuck for 300mm wafer
This heated work holder allows the heat treatment from3" wafer size up to 12" (300mm) wafer size.The heated work stage is available with or without quartz lift pins.
   

HPP-155-L
 		HPP-155-L
Programmable Hot Plate with lift pins with vacuum hold for 3" up to 6" wafer size wafer size or 150 x 150 mm substrate size.
   

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