Die Bonder PP5
for the following applications: Pick & PlaceFlip chip assemblyvery small and large components, IC, capa-chips, resistor chip, etc.
Standard Applications: MEMS, MMIC, Opto or IR Sensor, Laser diodes, strength gage - Model: PP5 with table on the top
- Accuracy: Up to 5 µm, Up to 1 µm (option flip)
- Die size: minimum 200*200 µm, maximum 50*50 mm
- Substrate size: Up to 150x500 mm
- Part fixture: by vacuum or clamp
- Motorized Tables: X 240 mm , Y: 90 mm , Manual theta.
- Speed: by joystick.
- Table resolution 1 µm
- Alignment: Manual with color CCD
- Digital Target generator
- Optical Zoom X12
- Direct placement
- 2 references points for auto-centering placement
- ndexed Pick and Placement mode
- Parameters: On LCD screen
- Bond force: Programmable 10g up to 3 000 g
- Bond Time: Programmable 0 up to 999 s
- Scrub: X Y and number
- Vacuum: Selectable on or off during bond
- Temperature: Programmable 0° up to 400°(option eutectic)
- Work height: adjustable
- Soft touch down speed
- Automatic pick up with pick up force Options:
- Ultasonic die bonding, Au SnPb
- Dispenser for glue or solder paste
- Stamping capability
- Dipping on Flux
- Reflow, thermal cycle is programmable
- Eutectic, thermal cycle is programmable
- Gas environement for high temp. cycle
- Hot Gaz Jet, for local eutectic (multiple die eutectic)
- Wafer sorter 4", 6", 8"
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