UniTemp - your partner for all kind of thermal processes

We develop and sell equipment for microelectronics.Our main focus is based on thermic process engineering. UniTemp combines the technical, ergonomical and economical function with perfect harmony in technics and design to achieve best quality. All UniTemp products are developed and manufactured in Germany.

Product lines:

REFLOW SOLDERING SYSTEMS

• Reflow solder systems
• 2 Zone High vacuum sealer for MEMS package
• NEW: VSS-450-300 for FLUX and contaminating processes

RAPID THERMAL PROCESS OVENS

• Rapid Thermal Process ovens with vacuum
• Plasma Cleaning and heating
• Vacuum Process Oven for up to 300 mm wafer size

• Wire Bonder semiautomatic 
• Wire Bond Tools
• Manual Pull-Testing (destroying and non-destroying)
• Hot chucks and hot plates

DIE BONDER AND WAFER SCRIBERS

• Pick & Place Die Bonder (Cefori)
• Wafer scriber, breaker and sorter (Cefori)