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Applications and processes:
- MEMS package sealing with getter activation
- Rapid Thermal Annealing/Processing
- Solder Bump Reflow with Plasma pre-cleaning
- Reflow Soldering, voidfree, fluxless and leadfree
- Baking and curing of photoresists
- Sensitive BCB Curing
- AuGe/SiAu alloying
- Flip-Chip soldering
- Package lead sealing
- Laser/RF/power die attachmentRapid Thermal Processing of Solar Cells by Silicon Wafer Bonding on low cost substratesProcessing of high efficiency silicon solar cells by bonding to borosilicate glass
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