Applications and processes:

• MEMS package sealing with getter activation
• Rapid Thermal Annealing/Processing
• Solder Bump Reflow with Plasma pre-cleaning
• Reflow Soldering, voidfree, fluxless and leadfree
• Baking and curing of photoresists
• Sensitive BCB Curing
• AuGe/SiAu alloying
• Flip-Chip soldering
• Package lead sealing
• Laser/RF/power die attachmentRapid Thermal Processing of Solar Cells by Silicon Wafer Bonding on low cost substratesProcessing of high efficiency silicon solar cells by bonding to borosilicate glass