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UniTemp - your partner for all kind of thermal processes

We develop and sell equipment for microelectronics.
Our main focus is based on thermic process engineering.
UniTemp combines the technical, ergonomical and economical function
with perfect harmony in technics and design to achieve best quality.
All UniTemp products are developed and manufactured in Germany.

WE ARE LOOKING FOR REPRESENTATIVES

Product lines:
  • Rapid Thermal Process ovens with vacuum
  • Reflow solder systems
  • Hot chucks and hot plates
  • Manual Pull-Testing (destroying and non-destroying)
  • Wire Bond Tools
  • Portable Vacuum Leak Detector
  • Pick & Place Die Bonder (Cefori)
  • Wafer scriber, breaker and sorter (Cefori)


    Sensor & Test 2010

    Come and visit us at the Sensor+Test 2010 show Nürnberg
    8.-10. June 2010


    Nepcon Tokio 20.-22. Jan 2010

    NEPCON Japan 2010, 11. IC Packaging Expo ICP
    20. - 22. Januar 2010, Tokyo Big Sight, Tokio, Japan
    we are coexhibitor at TPT Japan booth

    COME, SEE and GET information
  •   © 2007-2010 UniTemp GmbH | Last Update: 26.01.2010
    Plasma Cleaning & Heat
    Rapid Thermal Process Ovens
    Reflow Solder Systems
    Hot chucks with external controller
    Hot plates with Lift Pins
    Hot Plates with integrated controller
    Die Bonder
    Wafer scriber automatic
    Wafer scriber manual
    Wire bond tools
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    RSS-FA
    Vacuum Leak detector
    RSS-H2
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